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WESTFORD, Mass., Oct. 2 /PRNewswire/ -- In response to customer demand for industry standard analysis capabilities, Zuken announced a strategic partnership with Ansoft Corporation (Nasdaq: ANST) to use Ansoft's new ANF neutral file format interfaces for advanced 3D signal integrity analysis. Zuken is one of the first to adopt the newest ANF format, which enables the use of all Ansoft's industry standard analysis tools, including HFSS, Spicelink and Turbo Package Analyzer (TPA).

Under the terms of the agreement, Zuken will develop the interfaces while Ansoft will provide links for the interfaces. This is unique to the partnership; most companies require Ansoft to write the scripts to generate the ANF files. Zuken developed its own script and created the interfaces according to customer specifications.

``Our customers requested we build interfaces using the ANF file format, and Zuken went out and embraced it,'' commented Rick Lagasca, director of AP/ CR-5000 for Zuken. ``Using AnsoftLinks will extend Zuken's correct-by-design methodology into the 3D signal integrity domain by tightly linking the analysis tools from Ansoft into the Zuken design solution.''

Development of these interfaces will create a means to quickly and accurately connect between Zuken's physical design and Ansoft's analysis tools for parasitic extraction and SPICE simulation, and reduce interactive and error-prone duplication of geometry, saving engineers significant effort and time in the design/analysis progression for advanced packaging.

``Automating the analysis to characterize the package is a significant advancement for demanding time-to-market requirements,'' said Sherry Hess, Ansoft Corporation's vice president of marketing. ``The ANF file formats are widely accepted interfaces today, and Zuken's adoption of the latest industry requirement shows the company is committed to its customers. Zuken's advanced packaging capabilities combined with Ansoft's leading analysis software will ensure our customers have error-free, correct design before manufacturing begins.''

Ansoft's newest release of TPA automates the analysis of all complex semiconductor packages, including flip-chip, chip scale package and multiple die system-in-package design. TPA's extraction engine provides 3D analysis for solving any BGA package structure, including wirebonds, pads, vias, tapered traces, solder balls, and non-ideal power and ground structures. It also includes an industry first, multiple-accelerated Partial Element Equivalent Circuit (multi-PEEC) engine and an advanced model reduction algorithm for ultra-fast simulations of high-speed traces. The multi-PEEC engine allows long leads carrying high speed signals to be modelled using distributed circuits for greater accuracy.

Ansoft's simulation tools allow engineers to determine performance and compatibility before a design is committed to fabrication. The links will connect Ansoft's HFSS and Spicelink analysis tools with Zuken's CR-5000 Package Synthesizer, part of its Advanced Packaging Solution. In addition, Zuken has completed development of a direct interface from CR-5000 to Ansoft's TPA. The latest release of the TPA software can now address the importing of the ANF files as well as NF1 and NF2 files.

``It is imperative for advanced packaging and high density interconnect (HDI) designs to have a tightly integrated design/analysis function,'' commented Les Ammann, director of AP Technology for Zuken. ``Engineers must understand physical limitations and electrical constraints during the design process. An integrated analysis tool will enable engineers to check layout and performance before the design is committed to manufacturing.''

Zuken and Ansoft are currently developing a more integrated approach to the interface, where designers can launch Ansoft's tools from within Package Synthesizer. Designers will be able to actually perform a SPICE analysis or any other analysis within the packaging tool. This will save engineers significant analysis time and reduce overall design time, by providing the ability to verify signal integrity interactively during the design phase.

About Ansoft

Ansoft is a leading developer of high performance EDA software. Ansoft software is used by engineers to design state of the art technology products, such as cellular phones, internet networking equipment, satellites, computer chips and circuit boards, and electronic sensors. Ansoft markets its products through its own direct worldwide sales force, and has comprehensive customer support offices throughout North America, Asia and Europe. For more information, visit http://www.ansoft.com .

About Zuken

Zuken is one of the world's leading providers of professional software solutions for the design of PCB/MCM/IC packages and systems. These advanced tool sets facilitate schematic capture, placement, routing and analysis, and manufacture and test. Used by the world's top 30 electronic product manufacturers, the solutions operate under both UNIX and Microsoft Windows. Zuken is the market sector leader in Japan and has offices throughout Europe and the USA. It is a global organization employing over 1000 people and the company is listed on Level 1 of the Tokyo Stock Exchange. For more information, visit http://www.zuken.com .